------------ everything you need ------------
Our services
Die Inspection, Sorting & Transferring
From Wafer to Cavity Plate, From Wafer to Blue Tape, From Wafer to Gelpak, From Gelpak to Blue Tape.
Sawing
Sawing Capability : 4" to 8" wafer size, back grinding
Die Transfer from Blue Tape to Gelpak
Die is Transfer using Automated Machine
Soldering
Wire Soldering on Die Assembly
2 wires, @ wires with casing, 3 wires, 4 wires
Tape & Reel
Sample Products
Metal Cans
Metal Can
Metal Can
Metal Can
Metal Can
Molded Plastic Package
QFN Clear Molded Package
8L SOIC
Coating
Ceramics
Ceramic Coated
Ceramic Coated
TO Can Coated
PCB Assembly
Chip on Board Assembly
PCB
Chip on Board Metal Can
PCB Assembly
